The COM Express Type 7 modules defined by the PICMG consortium (www.picmg. org) trade all audio and video interfaces for four 10G Ethernet ports and a total of 32 PCI Express lanes in order to support enhanced micro servers, high performance embedded computers and other server Type applications that only allow for low power consumption but require high computing performance and communication throughput.
The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM.
The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged.
