SMARC 2.0 CPU modules for mobile applications and IoT

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU modules are ideal for mobile IoT-connected multimedia platforms and many other low-power graphics-intensive applications. Thus, SMARC 2.0 positions itself exactly between the two already well established module standards Qseven and COM Express.

The technical highlights of SMARC 2.1

SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. They offer embedded system developers a complete, off-the-shelf, credit-card sized embedded computing core that is ideal for IoT connected multimedia platforms and many other graphics-intensive low-power applications.

SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well. 

The module power envelope is typically under 6W and the form factor is ideal for applications that mandate designs able to withstand extreme environmental conditions.

SMARC 2.0 White Paper

The updated specification SMARC 2.1 extends this feature set even further:

SMARC_2-1_2-0_comparsion

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU... read more »
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SMARC 2.0 CPU modules for mobile applications and IoT

SMARC 2.0 is a new standard released by the Standardization Group for Embedded Technologies (SGET). With numerous graphics, camera, sound, networking and wireless interfaces, the SMARC 2.0 CPU modules are ideal for mobile IoT-connected multimedia platforms and many other low-power graphics-intensive applications. Thus, SMARC 2.0 positions itself exactly between the two already well established module standards Qseven and COM Express.

The technical highlights of SMARC 2.1

SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. They offer embedded system developers a complete, off-the-shelf, credit-card sized embedded computing core that is ideal for IoT connected multimedia platforms and many other graphics-intensive low-power applications.

SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well. 

The module power envelope is typically under 6W and the form factor is ideal for applications that mandate designs able to withstand extreme environmental conditions.

SMARC 2.0 White Paper

The updated specification SMARC 2.1 extends this feature set even further:

SMARC_2-1_2-0_comparsion

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conga-SMC1/SMARC-x86 conga-SMC1/SMARC-x86
conga-SMC1/SMARC-x86 Kompaktes Carrier Board für x86 / PC basierte SMARC 2.0 Module von congatec Das ca. 9 cm große conga-SMC1 / SMARC-x86 Board von congatec ermöglicht schnelle Projekt-Umsetzungen und bietet hohe Skalierbarkeit. Ein weiterer Vorteil des conga-SMC1 ist die schnelle Anpassung der I/O für Projekte in kleinen und mittleren Stückzahlen. Sofort einsetzbares SMARC...
conga-SMX8-Plus/i-QC-4G eMMC16 AW-CM276NF SMARC Module from congatec conga-SMX8-Plus product line. Part# 051322 conga-SMX8-Plus/i-QC-4G eMMC16 AW-CM276NF
SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz + NPU +1x ARM Cortex-M7, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Extended temperature range from -25°C to 80°C. With AzureWave AW-CM276NF onboard Wifi/BT module (Business Case required for Wifi/BT option).
conga-SMX8-Mini/i-Quad-4G eMMC16 SMARC Module from congatec conga-SMX8-Mini product line. Part# 051220 conga-SMX8-Mini/i-Quad-4G eMMC16
SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.6GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
Engineering Kits & Rapid Prototyping Engineering Kits & Rapid Prototyping
For evaluation, benchmark tests and so that our customers can start developing their application software as quickly as possible, we first implement a development kit ("Software Target") based on the intended key components. In the simplest case, this is based on the evaluation board from the manufacturer of the CPU platform in combination with additional standard hardware....
conga-SA7/CSP-B SMARC Module from congatec conga-SA7 product line. Part# 050153 conga-SA7/CSP-B
Passive cooling solution for SMARC 2.1 module conga-SA7 with open-die Intel® Pentium® and Celeron® J and N processorss. All standoffs are with 2.7mm bore hole.
Preferred Article Variant
Cooling Solution SA5/CSP-B for N4200, N3350, J3455 Cooling Solution SA5/CSP-B for N4200, N3350, J3455
Passive Cooling Solution für SMARC 2.0 Modul conga-SA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
Preferred Article Variant
Cooling Solution SA5/i-CSP-B for E3950, E3940, E3930 Cooling Solution SA5/i-CSP-B for E3950, E3940,...
Passive Cooling Solution für SMARC 2.0 Modul conga-SA5 mit lidded Intel Atom Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
conga-SA7/i-CSP-B SMARC Module from congatec conga-SA7 product line. Part# 050150 conga-SA7/i-CSP-B
Passive cooling solution for SMARC 2.1 module conga-SA7 with lidded Intel Atom® x6000E processors. All standoffs are with 2.7mm bore hole.
conga-SA7/HSP-B SMARC Module from congatec conga-SA7 product line. Part# 050152 conga-SA7/HSP-B
Standard heatspreader for SMARC 2.1 module conga-SA7 with open-die Intel® Pentium® and Celeron® J and N processors. All standoffs are with 2.7mm bore hole.
conga-SMX8-Mini/CSP-B SMARC Module from congatec conga-SMX8-Mini product line. Part# 051250 conga-SMX8-Mini/CSP-B
Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole.
Preferred Article Variant
conga-SA5-HSP-B-congatec-heatspreader-mctx Heatspreader SA5/HSP-B for N4200, N3350, J3455
Standard heatspreader für SMARC 2.0 Modul conga-SA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
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