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conga-TC370/4305UE conga-TC370/4305UE
conga-TC370 COM Express Type 6 Compact Modul TC370/4305UE von congatec mit Intel Celeron CPU 4305UE , Dual-Core mit 2.0GHz, 2MB L2 cache, GT1 Grafik und 2400MT/s dual channel DDR4 Speicherinterface (15W).
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conga-TEVAL/COMe 3.0 COM Express Type 6 Evaluation Carrier Board conga-TEVAL/COMe 3.0 COM Express Type 6...
Die Version conga-TEVAL2 / COMe 3.0 unterstützt neue Features wie z.B. einen M.2 Key B Steckplatz für Modulgrößen 3042, 2260 und 2280, USB 3.1, 3x Dual Mode Displayport und eDP. Für den schnellen Projektstart mit COM Express Typ 6 "Basic" und "Compact" CPU-Modulen bietet congatec das conga-TEVAL / COMe 3.0 Evaluation Carrier Board, das alle COM Express Signale an Standard-PC...
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conga-X7EVAL - COM Express Type 7 Evaluation Board conga-X7EVAL - COM Express Type 7 Evaluation Board
conga-X7EVAL Evaluation Carrier Board für congatec COM Express Typ 7-Module mit vier 10-GbE-SFP + -Faser / Kupfer-Ports. Das X7EVAL verfügt über einen Aspeed AST2500 Board Management Controller (BMC). Kommerzieller Temperaturbereich von 0 ° C bis 60 ° C. Um einen schnellen Start mit COM Express Typ 7-Modulen zu erreichen, bietet congatec das conga-X7EVAL Evaluation Carrier...
conga-X7EVAL/ind conga-X7EVAL/ind
Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No Board Management Controller (BMC). Industrial temperature range from -40°C to 85°C. To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors. Internal connectors 32x PCIe...
conga-B7XD/P-D1508 conga-B7XD/P-D1508
COM Express Type 7 Basic Modul mit Intel Pentium D1508 CPU mit 2 Cores, 2.2GHz bis zu 2.6GHz Core-Frequenz, 3MB Cache mit Intel Cache Allocation Technology und 1866 MT/s dual channel DDR4 Speicherinterface für bis zu 48GB SODIMM Speicher. Zwei 10GbE KR interface ports. 25W TDP, "commercial" Temperaturbereich.
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conga-B7AC/A-C3308 conga-B7AC/A-C3308
COM Express Type 7 Basic Modul mit Intel Atom C3308 CPU mit 2 Cores, 1.6 GHz Core-Frequenz, 4MB Cache und 2133 MT/s dual channel DDR4 Speicherinterface für bis zu 64 GByte. Vier 2.5GbE KX interface ports. 9.5W TDP, "commercial" Temperaturbereich.
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Cooling Solution QA5/CSP-T for N4200, N3350, J3455 Cooling Solution QA5/CSP-T for N4200, N3350, J3455
Passive Cooling Solution für Qseven Modul conga-QA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit M2.5mm Gewinde.
Cooling Solution QA5/CSP-B for N4200, N3350, J3455 Cooling Solution QA5/CSP-B for N4200, N3350, J3455
Passive Cooling Solution für Qseven Modul conga-QA5 mit open silicon Intel Pentium und Celeron Prozessor. Alle Distanzbolzen mit 2.7mm Befestigungsbohrung.
Cooling Solution TS170/CSA-HP-B Cooling Solution TS170/CSA-HP-B
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Cooling Solution TS170/CSA-HP-T Cooling Solution TS170/CSA-HP-T
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Cooling Solution TS170/CSP-HP-B Cooling Solution TS170/CSP-HP-B
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Cooling Solution TS170/CSP-HP-T Cooling Solution TS170/CSP-HP-T
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.
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